Simplification & Cost Reduction - move all components to top side #12
Description
Consider moving all components to the top-side of the board, without exceeding the lowest fab-cost 5x5cm standard, to simplify assembly and reduce board cost - @fallberg mentioned this earlier on a Hangouts thread.
Considerations:
- Part reduction (e.g. move from dual to single LDO in 5VDC vs. 3.3VDC for IR LED circuit #9, MCU/Flash consolidation Evaluate using the SAM D2x series MCU in lieu of the 328p & companion 512Kb flash for MySensors Core #11, non-essential pads/sockets, etc.)
- Increase the board height slightly - currently 3.59cm high so we have almost 1.5cm of additional vertical board space we can add
- Opportunity to re-orient radio to provide ample antenna clearance?